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PACDN006
PACKAGE DIMENSIONS
MSOP8
CASE 846AB ? 01
ISSUE O
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
H E
E
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
PIN 1 ID
SEATING
? T ? PLANE
0.038 (0.0015)
e
b 8 PL
0.08 (0.003)
A
M
T B
S
A
S
DIM
A
A1
b
c
D
E
e
L
H E
MILLIMETERS
MIN NOM MAX
?? ?? 1.10
0.05 0.08 0.15
0.25 0.33 0.40
0.13 0.18 0.23
2.90 3.00 3.10
2.90 3.00 3.10
0.65 BSC
0.40 0.55 0.70
4.75 4.90 5.05
MIN
??
0.002
0.010
0.005
0.114
0.114
0.016
0.187
INCHES
NOM
??
0.003
0.013
0.007
0.118
0.118
0.026 BSC
0.021
0.193
MAX
0.043
0.006
0.016
0.009
0.122
0.122
0.028
0.199
A1
c
L
SOLDERING FOOTPRINT*
8X
1.04
0.041
3.20
0.126
0.38
0.015
8X
4.24
0.167
5.28
0.208
6X
0.65
0.0256
SCALE 8:1
mm
inches
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6
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